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The gold wire ball welding bonding machine is mainly used in universities, research institutes, research and development centers, and production design. Integrated circuit sensors and precision welding instruments for micro (um) electrode inner leads are easy to operate and use, effectively improving work efficiency and quality.
The ultrasonic thick aluminum wire press welding bonding machine can be applied to the internal lead welding of semiconductor power devices such as high and medium power transistors, Field-effect transistor, IGBT, high current fast recovery diodes, schottky diodes, silicon controlled rectifier and power modules. The diameter of aluminum wire: 125~500um
Strong source manufacturer with advanced technology, flexible movement, accurate positioning, and precise guide rail with fast matching speed, especially suitable for precision welding of micrometer (um) electrodes, suitable for laboratory research and development of process chips, internal aluminum wire lead welding of electrodes, providing strong technical support for production and manufacturing
The fully automatic gold wire ball bonding machine is mainly used in universities, research institutes, R&D centers, and production design departments. It is a precision welding instrument for the internal lead wires of integrated circuit sensors and some micrometer (um) electrodes. It is easy to operate and effectively improves work efficiency and quality.
Shenzhen Xuchen Semiconductor Technology Co., Ltd
Shenzhen Xuchen Semiconductor Technology Co., Ltd. is a technology enterprise that focuses on the production, sales, and technical services of semiconductor ultrasonic wire bonding machines. It has been well received by users in more than ten countries and regions in Hong Kong, Macau, Africa, Asia, and other continents
The company mainly produces equipment such as ultrasonic wire ball welding machines, aluminum wire welding machines, and coarse aluminum wire bonding machines, which are widely used in small and medium-sized power, sensors, thick film integrated circuits, transistors, and chip bonding technology
The company has an efficient and professional R&D team dedicated to the R&D and application of semiconductor chip welding technology and Integrated circuit packaging technology. The company has advanced processes and equipment in chip soldering technology, which can achieve high-precision wafer lead soldering, ensuring product quality and reliability. In terms of ultrasonic welding wire technology, the stability performance and service life of the product have been greatly improved
Xuchen adheres to the concept of "quality first, customer first", adheres to the corporate culture of "integrity, innovation, dedication, and cooperation", and continuously improves product quality and service level with a stable and pragmatic business approach, winning the trust and support of a large number of customers
In the future, Xuchen Semiconductor will be market-oriented, increase investment in technology research and development, expand product application fields, and achieve the company's development goals. The company will continue to be committed to providing customers with high-performance and highly reliable ultrasonic bonding products, and providing high-quality semiconductor process solutions to customers worldwide
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