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XE-2018 Ultrasonic Gold Wire Ball Welding Bonding Machine
The gold wire ball welding bonding machine is mainly used in universities, research institutes, research and development centers, and production design. Integrated circuit sensors and precision welding instruments for micro (um) electrode inner leads are easy to operate and use, effectively improving work efficiency and quality.
XE-2018 Ultrasonic Gold Wire Ball Welding Bonding Machine
Product Features
Agile movements/accurate positioning/high speed
The machine's welding head, displacement, and clamping mechanisms are all driven by stepper motors and guided by precision guide rails, ensuring flexible movement. It offers accurate positioning and high speed, making it particularly suitable for micron (µm) level precision electrode welding. Welding pressure is controlled by an electromagnet, providing stable and reliable output pressure. The ultrasonic power has a wide adjustment range, and the ultrasonic frequency automatically tracks and locks, resulting in stable, reliable, and consistent welding quality. The sparking and ball-forming process uses negative electron sparking control, which is precise and reliable, effectively extending the life of the sparking blade, and includes an alarm for unsuccessful sparking. (Stepper motors are pulse motors.)
XE-219 Ultrasonic Coarse Aluminum Wire Pressure Welding and Bonding Machine
The ultrasonic thick aluminum wire press welding bonding machine can be applied to the internal lead welding of semiconductor power devices such as high and medium power transistors, Field-effect transistor, IGBT, high current fast recovery diodes, schottky diodes, silicon controlled rectifier and power modules. The diameter of aluminum wire: 125~500um
XE-219 Ultrasonic Coarse Aluminum Wire Pressure Welding and Bonding Machine
Firstly, we would like to thank you for choosing our company's ultrasonic coarse aluminum wire pressure welding machine product.
2. Thank you for your trust in us! Thank you for your support 3. This machine can be used for internal lead welding of various semiconductor power devices 4. The excellent performance and rich functions of this machine represent our company's professional level and rich experience in ultrasonic micro welding technology, and also represent the development mileage of domestic semiconductor device internal lead welding equipment
5. Principle of Ultrasonic welding
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XE-2010 Ultrasonic Aluminum Wire Pressure Welding and Bonding Machine
Strong source manufacturer with advanced technology, flexible movement, accurate positioning, and precise guide rail with fast matching speed, especially suitable for precision welding of micrometer (um) electrodes, suitable for laboratory research and development of process chips, internal aluminum wire lead welding of electrodes, providing strong technical support for production and manufacturing
XE-2010 Ultrasonic Aluminum Wire Pressure Welding and Bonding Machine
Product features
Flexible action, accurate positioning, fast speed
The front and back, up and down movements of the welding head are driven by a stepper motor
and cooperate with precision guide rails, making it flexible, accurate positioning, and fast, especially suitable for precision welding of micrometer (um) level electrodes. The parameters such as ultrasonic power, welding time and pressure, aiming height and span of first and second welding, arch wire height, and lighting can be easily adjusted through various knobs on the panel to achieve the optimal welding state. Welding pressure adopts electromagnetic control, with a wide range of ultrasonic power adjustment, automatic tracking and locking of ultrasonic frequency, stable and reliable welding quality, and equipped with automatic welding function - automatically completing the second welding point
XE-2019 fully automatic gold wire ball bonding machine
The fully automatic gold wire ball bonding machine is mainly used in universities, research institutes, R&D centers, and production design departments. It is a precision welding instrument for the internal lead wires of integrated circuit sensors and some micrometer (um) electrodes. It is easy to operate and effectively improves work efficiency and quality.
XE-2019 fully automatic gold wire ball bonding machine
English name: Gold bonding wire, also known as ball bonding wire or lead wire. Meaning: Gold wire used as a connecting wire in integrated circuits. Purity: Gold content ≥99.99%. Bond alloy wire is an important material in the microelectronics industry, used as a connecting wire between chips and lead frames Building alloy lines is an important step in the production of integrated circuits, which involves connecting circuit chips with lead frames. Bonding wire is a micro metal wire inner lead used during the assembly of semiconductor devices and integrated circuits to achieve electrical connection between the input/output bonding points of the circuit inside the chip and the internal contacts of the lead frame. The bonding effect directly affects the performance of integrated circuits. Bonding wire is one of the five basic materials in the overall 1C packaging material market. It is an inner lead material with excellent electrical, thermal, mechanical, and chemical stability. It is an important structural material for manufacturing integrated circuits and discrete devices. Bonding wire is mainly used in various electronic components, such as diodes, transistors, integrated circuits, etc.
