XE-2019 fully automatic gold wire ball bonding machine-Product Center-Shenzhen Xuchen Semiconductor Technology Co., Ltd

Product Center

XE-2019 fully automatic gold wire ball bonding machine

The fully automatic gold wire ball bonding machine is mainly used in universities, research institutes, R&D centers, and production design departments. It is a precision welding instrument for the internal lead wires of integrated circuit sensors and some micrometer (um) electrodes. It is easy to operate and effectively improves work efficiency and quality.

English name: Gold bonding wire, also known as ball bonding wire or lead wire. Meaning: Gold wire used as a connecting wire in integrated circuits. Purity: Gold content ≥99.99%. Bond alloy wire is an important material in the microelectronics industry, used as a connecting wire between chips and lead frames Building alloy lines is an important step in the production of integrated circuits, which involves connecting circuit chips with lead frames. Bonding wire is a micro metal wire inner lead used during the assembly of semiconductor devices and integrated circuits to achieve electrical connection between the input/output bonding points of the circuit inside the chip and the internal contacts of the lead frame. The bonding effect directly affects the performance of integrated circuits. Bonding wire is one of the five basic materials in the overall 1C packaging material market. It is an inner lead material with excellent electrical, thermal, mechanical, and chemical stability. It is an important structural material for manufacturing integrated circuits and discrete devices. Bonding wire is mainly used in various electronic components, such as diodes, transistors, integrated circuits, etc.

Application scenario